CPC H05K 1/189 (2013.01) [H05K 1/0218 (2013.01); H05K 1/0256 (2013.01); H05K 7/20954 (2013.01)] | 18 Claims |
1. A flexible circuit board assembly, comprising:
a first flexible circuit board, comprising a device part provided with components;
a first wave absorbing layer, disposed on a side of the device part and configured to cover the components; and
a conductive fabric layer, disposed on a side of the first wave absorbing layer facing away from the first flexible circuit board, and configured to cover the first wave absorbing layer;
wherein an edge of the conductive fabric layer are bonded to the first flexible circuit board.
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