US 11,991,827 B2
Electronic device
Chun-Yen Ting, Kaohsiung (TW); Pao-Nan Lee, Kaohsiung (TW); Hung-Chun Kuo, Kaohsiung (TW); Jung Jui Kang, Kaohsiung (TW); and Chang Chi Lee, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Oct. 14, 2022, as Appl. No. 17/966,701.
Prior Publication US 2024/0130043 A1, Apr. 18, 2024
Int. Cl. H05K 1/14 (2006.01)
CPC H05K 1/141 (2013.01) 17 Claims
OG exemplary drawing
 
1. An electronic device, comprising: a system board; a first set of electronic devices disposed over the system board, wherein each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit; and a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit, further comprising: a second set of electronic devices disposed over the system board; and a second interconnection structure electrically connecting with the second set of electronic devices and configured to receive a second power from a second power supply unit and transmit the second power to the second set of electronic devices, wherein the first set of electronic devices are closer to a first central processing unit (CPU) disposed over the system board than the second set of electronic devices, and the second set of electronic devices are closer to a second CPU disposed over the system board than the first set of electronic devices.