US 11,991,826 B2
Flexible printed circuit board
Jongmin Kim, Pyeongtaek-si (KR); Dong Pil Park, Incheon (KR); and Yoonho Huh, Seoul (KR)
Assigned to DONGWOO FINE-CHEM CO., LTD., Iksan-si (KR)
Appl. No. 17/602,527
Filed by DONGWOO FINE-CHEM CO., LTD., Iksan-si (KR)
PCT Filed Apr. 10, 2020, PCT No. PCT/KR2020/004943
§ 371(c)(1), (2) Date Oct. 8, 2021,
PCT Pub. No. WO2020/209689, PCT Pub. Date Oct. 15, 2020.
Claims priority of application No. 10-2019-0043150 (KR), filed on Apr. 12, 2019.
Prior Publication US 2022/0174819 A1, Jun. 2, 2022
Int. Cl. H05K 1/11 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 1/48 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01)
CPC H05K 1/118 (2013.01) [H01Q 1/38 (2013.01); H05K 1/0218 (2013.01); H05K 1/189 (2013.01); H05K 3/281 (2013.01); H05K 2201/09327 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A flexible printed circuit board, comprising:
an upper wiring layer;
a lower wiring layer insulated and stacked under the upper wiring layer;
a first connection part protruding and extending from one side of the lower wiring layer;
a second connection part protruding and extending from the other side of the lower wiring layer;
a power and signal wiring layer insulated and stacked between the upper wiring layer and the lower wiring layer to transmit power and signals, wherein
the power and signal wiring layer includes
a power wiring layer configured to transmit power; and
a signal wiring layer insulated and stacked over or under the power wiring layer, and
a plurality of ground layers insulated and stacked between respective layers of the upper wiring layer, the power wiring layer, the signal wiring layer, and the lower wiring layer.