US 11,991,824 B2
Circuit board structure and manufacturing method thereof
Tzyy-Jang Tseng, Hsinchu (TW); Cheng-Ta Ko, Taipei (TW); Pu-Ju Lin, Hsinchu (TW); Chi-Hai Kuo, Taoyuan (TW); Shao-Chien Lee, Taoyuan (TW); Ming-Ru Chen, Hsinchu (TW); and Cheng-Chung Lo, Hsinchu County (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Sep. 26, 2021, as Appl. No. 17/448,893.
Application 17/448,893 is a continuation in part of application No. 17/191,559, filed on Mar. 3, 2021, granted, now 11,540,396.
Claims priority of provisional application 63/071,369, filed on Aug. 28, 2020.
Claims priority of application No. 110101060 (TW), filed on Jan. 12, 2021; and application No. 110125380 (TW), filed on Jul. 9, 2021.
Prior Publication US 2022/0071010 A1, Mar. 3, 2022
Int. Cl. H05K 1/02 (2006.01); G02F 1/1333 (2006.01); G02F 1/1368 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H10K 59/12 (2023.01); H10K 59/123 (2023.01); H10K 59/124 (2023.01); H10K 59/131 (2023.01)
CPC H05K 1/115 (2013.01) [H05K 1/0306 (2013.01); H05K 3/0067 (2013.01); H05K 3/0094 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A circuit board structure, comprising:
a glass substrate;
an electrode layer located on the glass substrate;
a first sub-circuit board located on the glass substrate and the electrode layer, wherein the first sub-circuit board comprises a fourth conductive through hole, and the fourth conductive through hole is located in the first sub-circuit board and on the electrode layer;
a first redistribution layer located on the first sub-circuit board and the fourth conductive through hole, wherein the fourth conductive through hole electrically connects to the electrode layer and the first redistribution layer;
an antioxidant layer located on the first redistribution layer, wherein the antioxidant layer is made of a material comprising gold;
a pixel unit located on the antioxidant layer; and
a mold located on the pixel unit, the antioxidant layer and the first sub-circuit board.