US 11,991,823 B2
Conductive film and manufacturing method thereof
Chih-Yi Lin, Kaohsiung (TW); Kuo-Kuang Cheng, Kaohsiung (TW); Chi-Chin Chiang, Kaohsiung (TW); Wen-Hsin Tai, Kaohsiung (TW); I-Ju Wu, Kaohsiung (TW); and Chi-Ho Tien, Kaohsiung (TW)
Assigned to SAN FANG CHEMICAL INDUSTRY CO., LTD., Kaohsiung (TW)
Filed by SAN FANG CHEMICAL INDUSTRY CO., LTD., Kaohsiung (TW)
Filed on May 28, 2021, as Appl. No. 17/333,972.
Claims priority of application No. 109119104 (TW), filed on Jun. 5, 2020.
Prior Publication US 2021/0385947 A1, Dec. 9, 2021
Int. Cl. H05K 1/03 (2006.01); B29C 48/00 (2019.01); C08L 75/04 (2006.01); C09D 11/52 (2014.01); B29K 75/00 (2006.01)
CPC H05K 1/036 (2013.01) [B29C 48/0021 (2019.02); B29C 48/022 (2019.02); C08L 75/04 (2013.01); C09D 11/52 (2013.01); B29K 2075/00 (2013.01); B29K 2995/0016 (2013.01); C08L 2207/04 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A manufacturing method of a conductive film, comprising:
preparing a TPU surface layer and a TPU complex layer, the TPU complex layer having a TPU heat-resistant layer and a TPU melting layer, and the TPU heat-resistant layer disposed on the TPU melting layer, wherein preparing the TPU surface layer further comprises: first TPU particles with melting point of 70-180° C. and a Shore hardness of 50-95 A are utilized, and the first TPU particles are dried until the moisture content thereof is below 300 ppm;
printing a conductive layer on the TPU heat-resistant layer of the TPU complex layer; and
thermally bonding the TPU surface layer, the TPU complex layer on which the conductive layer has been printed, and a base layer, and the TPU surface layer, the TPU complex layer having the conductive layer, and the base layer are stacked sequentially from top to bottom.