US 11,991,822 B2
Wiring board and manufacturing method of the wiring board
Hiroki Furushou, Tokyo (JP); Atsuko Chigira, Tokyo (JP); Toshio Sasao, Tokyo (JP); and Hiroshi Mawatari, Tokyo (JP)
Assigned to DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Filed by DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Filed on Sep. 3, 2020, as Appl. No. 17/011,260.
Application 17/011,260 is a continuation of application No. PCT/JP2019/012249, filed on Mar. 22, 2019.
Claims priority of application No. 2018-061148 (JP), filed on Mar. 28, 2018.
Prior Publication US 2020/0404781 A1, Dec. 24, 2020
Int. Cl. H05K 1/02 (2006.01); B32B 15/04 (2006.01); H01L 23/40 (2006.01); H05K 3/38 (2006.01)
CPC H05K 1/0298 (2013.01) [B32B 15/04 (2013.01); H01L 23/40 (2013.01); H05K 3/38 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A wiring board comprising:
a substrate containing a first element;
a diffusion layer in contact with the substrate, the diffusion layer containing a first metal element;
a first metal film in contact with the diffusion layer, the first metal film containing a second metal element; and
a second metal film over and in contact with the first metal film,
wherein the diffusion layer has at least a region containing the first element and the first metal element and a region containing the first metal element and the second metal element,
the first metal element exists as an oxide in the diffusion layer,
the substrate has a through hole, and
the diffusion layer, the first metal film, and the second metal film continuously cover an upper surface and a lower surface of the substrate and a sidewall of the through hole.