US 11,991,819 B2
Microstrip delay matching using printed dielectric material
Bhyrav Mutnury, Austin, TX (US); Timothy M. Lambert, Austin, TX (US); and Sandor Farkas, Round Rock, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on Sep. 20, 2022, as Appl. No. 17/948,854.
Prior Publication US 2024/0098883 A1, Mar. 21, 2024
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/024 (2013.01) [H05K 1/0245 (2013.01); H05K 1/0248 (2013.01); H05K 2201/0715 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a first microstrip circuit trace on an outer surface of the printed circuit board, the first microstrip circuit trace having a first straight section with a first length and configured to carry a first signal;
a second microstrip circuit trace adjacent to the first microstrip circuit trace on the outer surface, the second microstrip circuit having a second straight section with a second length longer than the first length and configured to carry a second signal; and
a patterned dielectric material applied over a first portion of the first straight section to delay the first signal relative to the second signal.