CPC H05K 1/0203 (2013.01) [H05K 5/0026 (2013.01); H05K 7/2089 (2013.01); H05K 2201/10272 (2013.01)] | 14 Claims |
1. A circuit structure comprising:
a heat-generating component that generates heat when energized;
an energization bus bar that is connected to a connection portion of the heat-generating component;
a cooling member that is formed separately from the energization bus bar, and is connected to the connection portion of the heat-generating component along with the energization bus bar; and
a heat transfer portion that is provided in the cooling member, and is in heat-conductive contact with a heat-dissipating body,
wherein a direction in which the energization bus bar extends from the connection portion of the heat-generating component and a direction in which the cooling member extends from the connection portion of the heat-generating component are different, and
wherein an external connection portion of the energization bus bar extends in a plane parallel to, and in a same direction as, the heat transfer portion of the cooling member.
|