US 11,991,493 B2
Microphone package and electronic apparatus including the same
Yongseop Yoon, Seoul (KR); and Cheheung Kim, Yongin-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 2, 2022, as Appl. No. 17/734,677.
Claims priority of application No. 10-2021-0185411 (KR), filed on Dec. 22, 2021.
Prior Publication US 2023/0199358 A1, Jun. 22, 2023
Int. Cl. H04R 1/04 (2006.01); H04R 1/08 (2006.01); H04R 1/34 (2006.01)
CPC H04R 1/04 (2013.01) [H04R 1/083 (2013.01); H04R 1/342 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A microphone package comprising:
a substrate in which an acoustic hole and a via hole are formed, the via hole extending through the substrate from a front surface of the substrate to a rear surface of the substrate;
an acoustic sensor attached to the front surface of the substrate and covering the acoustic hole;
a first electrode pad provided on the front surface of the substrate;
a second electrode pad provided on the rear surface of the substrate and electrically connected to the first electrode pad through the via hole; and
a third electrode pad provided on a side surface of the substrate and electrically connected to the second electrode pad.