US 11,991,277 B2
Cryptographic hardware security module with secure embedded heat pipe
Arthur J. Higby, Cottekill, NY (US); David Clifford Long, Wappingers Falls, NY (US); Edward N. Cohen, Kingston, NY (US); John R. Dangler, Rochester, MN (US); Matthew Doyle, Chatfield, MN (US); Philipp K. Buchling Rego, Wappingers Falls, NY (US); William Santiago-Fernandez, Hopewell Junction, NY (US); Levi Campbell, Poughkeepsie, NY (US); and James Busby, New Paltz, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Aug. 17, 2021, as Appl. No. 17/404,071.
Prior Publication US 2023/0054606 A1, Feb. 23, 2023
Int. Cl. H04L 9/08 (2006.01); F28D 15/02 (2006.01)
CPC H04L 9/0877 (2013.01) [F28D 15/0275 (2013.01)] 18 Claims
OG exemplary drawing
 
7. A method comprising:
providing a printed circuit board comprising a component;
encapsulating the printed circuit board in an encapsulation structure comprising a top can and a bottom can, the top can fixed to a first surface of the printed circuit board, the bottom can fixed to second surface of the printed circuit board opposite the first surface; and
positioning a heat pipe between the top can and the component, the heat pipe comprising two or more bends, the heat pipe further comprising at least two internal blocking elements that extend in a direction perpendicular to a run of the heat pipe from opposite edges of the heat pipe, the internal blocking elements comprising a material having a higher density than a density of a bulk material of the heat pipe;
wherein a portion of the heat pipe extends beyond a secure region of the encapsulation structure.