US 11,990,967 B2
Sub-terahertz sub-band flattening feedback
Ran Berliner, Kfar-Aviv (IL); Shay Landis, Hod Hasharon (IL); Yehonatan Dallal, Kfar Saba (IL); and Assaf Touboul, Netanya (IL)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Mar. 28, 2022, as Appl. No. 17/656,779.
Application 17/656,779 is a continuation of application No. 17/089,511, filed on Nov. 4, 2020, granted, now 11,290,170.
Prior Publication US 2022/0286182 A1, Sep. 8, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04L 5/00 (2006.01); H04B 7/0456 (2017.01); H04B 7/06 (2006.01); H04W 24/10 (2009.01)
CPC H04B 7/0639 (2013.01) [H04B 7/0456 (2013.01); H04B 7/0626 (2013.01); H04L 5/0048 (2013.01); H04W 24/10 (2013.01)] 42 Claims
OG exemplary drawing
 
1. An apparatus for wireless communication at a device, comprising:
memory; and
one or more processors coupled to the memory, the one or more processors configured to cause the device to:
receive a reference signal;
measure an amplitude and a phase of the reference signal relative to a set point;
transmit channel flattening information in a precoding feedback; and
receive one or more data in a single tap channel or via a single tap receiver.