US 11,990,940 B2
Subminiature optical transmission module and method for manufacturing same by using semiconductor packaging scheme
Seong Wook Choi, Seoul (KR); and Young June Park, Seoul (KR)
Assigned to LIPAC CO., LTD., Seoul (KR)
Appl. No. 17/641,725
Filed by LIPAC CO., LTD., Seoul (KR)
PCT Filed Sep. 21, 2020, PCT No. PCT/KR2020/012713
§ 371(c)(1), (2) Date Mar. 9, 2022,
PCT Pub. No. WO2021/054803, PCT Pub. Date Mar. 25, 2021.
Claims priority of application No. 10-2019-0115860 (KR), filed on Sep. 20, 2019.
Prior Publication US 2022/0321226 A1, Oct. 6, 2022
Int. Cl. H04B 14/02 (2006.01); G02B 6/42 (2006.01); H04B 10/50 (2013.01); H04J 14/02 (2006.01); H04Q 11/00 (2006.01)
CPC H04B 10/501 (2013.01) [G02B 6/4215 (2013.01); G02B 6/4228 (2013.01); H04J 14/02 (2013.01); H04Q 2011/0032 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An optical transmission module comprising:
a mold body having a first surface and a second surface opposite to the first surface;
a plurality of edge-type light emitting elements, each of which is molded inside the mold body by fitting same to the first surface so as to match with the first surface and generates an optical signal in an edge direction of a chip; and
an optical component disposed on one side of the plurality of edge-type light emitting elements and molded inside the mold body, the optical component optically multiplexes a plurality of optical signals incident from the plurality of edge-type light emitting elements and to output a multiplexed optical signal,
wherein the optical component includes an arrayed waveguide grating (AWG) which includes, on one side thereof, a plurality of input waveguides corresponding to the plurality of edge-type light emitting elements, and optically multiplexes the plurality of optical signals incident through the plurality of input waveguides and outputs the multiplexed optical signal through an output waveguide, and
each of the light emitting elements has an optical axis height set to be the same as a core of each of the input waveguides.