CPC H03K 3/0315 (2013.01) [G01K 7/32 (2013.01); H03L 1/027 (2013.01); H03L 7/0991 (2013.01); H03L 7/18 (2013.01); H03L 7/1976 (2013.01)] | 17 Claims |
1. A device comprising:
a first microelectromechanical systems (MEMS) structure having a body that is to move or deflect;
a second MEMS structure having a body that is to move or deflect; and
circuitry to generate temperature correction information dependent on the movement or deflection of each of the body of the first MEMS structure and the body of the second MEMS structure; and
circuitry to process a signal representing measurement of the movement or deflection of the body of the first MEMS structure, in dependence on the temperature correction information, to produce an output;
wherein the device comprises a first die and a second die mounted to the first die, wherein the first die carries the first MEMS structure and the second MEMS structure, wherein the second die carries the circuitry to generate and the circuitry to process, and wherein the device comprises a pin to carry the output.
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