CPC H03H 3/02 (2013.01) [H03H 9/02015 (2013.01); H03H 9/0211 (2013.01); H03H 9/02157 (2013.01); H03H 9/131 (2013.01)] | 20 Claims |
1. A method for manufacturing an acoustic device comprising:
providing a substrate;
providing a bottom electrode over the substrate;
providing a sacrificial layer on the bottom electrode;
patterning the bottom electrode and the sacrificial layer;
polishing the sacrificial layer such that a portion of the sacrificial layer remains on the bottom electrode; and
removing the remaining portion of the sacrificial layer via a cleaning process such that a surface roughness of the bottom electrode is maintained.
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