US 11,990,812 B2
Routing structure of conductive wire, motor, resolver, and method for manufacturing electronic device
Yoichi Sekii, Kyoto (JP)
Assigned to NIDEC CORPORATION, Kyoto (JP)
Filed by NIDEC CORPORATION, Kyoto (JP)
Filed on Aug. 5, 2022, as Appl. No. 17/881,603.
Claims priority of application No. 2021-129612 (JP), filed on Aug. 6, 2021.
Prior Publication US 2023/0037663 A1, Feb. 9, 2023
Int. Cl. H02K 3/28 (2006.01); H02K 1/16 (2006.01); H02K 3/12 (2006.01); H02K 3/34 (2006.01); H02K 15/10 (2006.01)
CPC H02K 3/28 (2013.01) [H02K 1/165 (2013.01); H02K 3/12 (2013.01); H02K 3/34 (2013.01); H02K 15/105 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A routing structure of a conductive wire, comprising:
a conductive body portion;
a conductive guide portion fixed to the body portion and including a protruding portion protruding to an outside of the body portion;
a conductive wire hooked on the protruding portion of the guide portion; and
a first insulating portion that is disposed between the body portion and the guide portion and insulates the body portion from the guide portion, wherein
the protruding portion of the guide portion includes a contact portion that comes into contact with the conductive wire, and
the guide portion includes a second insulating portion that covers at least the contact portion and insulates the conductive wire and the guide portion.