US 11,990,725 B2
Optical module
Dan Li, Shandong (CN); Mengbo Fu, Shandong (CN); Qinhao Fu, Shandong (CN); Yifan Xie, Shandong (CN); and Tengfei Wang, Shandong (CN)
Assigned to HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Shandong (CN)
Filed by Hisense Broadband Multimedia Technologies Co., Ltd., Shandong (CN)
Filed on Sep. 15, 2021, as Appl. No. 17/475,775.
Application 17/475,775 is a continuation in part of application No. PCT/CN2020/120922, filed on Oct. 14, 2020.
Claims priority of application No. 202010442741.0 (CN), filed on May 22, 2020; application No. 202010442745.9 (CN), filed on May 22, 2020; application No. 202020885055.6 (CN), filed on May 22, 2020; and application No. 202020885645.9 (CN), filed on May 22, 2020.
Prior Publication US 2022/0006253 A1, Jan. 6, 2022
Int. Cl. H01S 3/04 (2006.01); G02B 6/42 (2006.01); H04B 10/50 (2013.01)
CPC H01S 3/0405 (2013.01) [G02B 6/4206 (2013.01); G02B 6/4271 (2013.01); G02B 6/428 (2013.01); H04B 10/503 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An optical module, comprising:
a shell;
a circuit board disposed in the shell and including a signal line and a ground metal wire that are disposed on a surface thereof; and
an optical transmitter device disposed in the shell, the optical transmitter device including:
a plate-shaped substrate; and
a laser assembly disposed on a surface of the substrate, electrically connected to the circuit board, and configured to emit an optical signal; wherein
the substrate is fixedly connected to an end of the circuit board;
the laser assembly includes:
a spacer disposed on the surface of the substrate, and including another signal line and another ground metal wire that are insulated from each other; and
a laser chip disposed on a surface of the spacer away from the substrate, and configured to emit the optical signal; wherein
the signal line of the spacer is electrically connected to an anode of the laser chip, and is electrically connected to the signal line of the circuit board; the ground metal wire of the spacer is electrically connected to a cathode of the laser chip, and is electrically connected to the ground metal wire of the circuit board.