US 11,990,704 B2
Reliable miniature implantable connector with high channel density and methods of using the same
Jack Judy, Gainesville, FL (US); and Paritosh Rustogi, Gainesville, FL (US)
Assigned to UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INCORPORATED, Gainesville, FL (US)
Appl. No. 17/282,894
Filed by UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INCORPORATED, Gainesville, FL (US)
PCT Filed Oct. 4, 2019, PCT No. PCT/US2019/054765
§ 371(c)(1), (2) Date Apr. 5, 2021,
PCT Pub. No. WO2020/072941, PCT Pub. Date Apr. 9, 2020.
Claims priority of provisional application 62/882,302, filed on Aug. 2, 2019.
Claims priority of provisional application 62/741,642, filed on Oct. 5, 2018.
Prior Publication US 2021/0351544 A1, Nov. 11, 2021
Int. Cl. H01R 13/52 (2006.01); A61N 1/375 (2006.01); H01R 13/24 (2006.01); H01R 13/621 (2006.01); H01R 43/20 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 5/04 (2006.01)
CPC H01R 13/5219 (2013.01) [A61N 1/3754 (2013.01); H01R 13/2407 (2013.01); H01R 13/621 (2013.01); H01R 43/205 (2013.01); H05K 5/0008 (2013.01); H05K 5/0095 (2013.01); H05K 5/0247 (2013.01); H05K 5/04 (2013.01); H01R 2201/12 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a lower plate;
a lower pad array comprising a plurality of lower pads, each lower pad arranged in a first pattern and the lower pad array positioned above the lower plate;
a gasket layer positioned above the lower pad array;
a conductive element array comprising a plurality of conductive elements, each conductive element arranged in a second pattern, the conductive element array positioned above the lower pad array;
an upper pad array comprising a plurality of upper pads, each upper pad arranged in a third pattern, the upper pad array positioned above the conductive element array;
an upper plate; and
a clamping mechanism that enables the lower plate, lower pad array, gasket layer, conductive element array, upper pad array, and upper plate to be compressed together,
wherein the plurality of conductive elements are one or more of:
fabricated as an integral part of the lower pad array;
fabricated as an integral part of the upper pad array;
fabricated as an integral part of the gasket layer; or
fabricated as an integral part of one or more of a feed through array or the gasket layer.