US 11,990,701 B2
Receptacle connector including electromagnetic compatibility (EMC) shield
Seon Gyun Baek, Suwon-si (KR); Jae Hong Park, Suwon-si (KR); Yusuf Cinar, Yongin-si (KR); and Han Hong Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 12, 2022, as Appl. No. 17/743,197.
Application 17/743,197 is a continuation of application No. 16/822,872, filed on Mar. 18, 2020, granted, now 11,495,907.
Claims priority of application No. 10-2019-0080067 (KR), filed on Jul. 3, 2019; and application No. 10-2019-0127562 (KR), filed on Oct. 15, 2019.
Prior Publication US 2022/0278475 A1, Sep. 1, 2022
Int. Cl. H01R 13/50 (2006.01); H01R 13/40 (2006.01); H01R 13/405 (2006.01); H01R 13/6581 (2011.01); H01R 13/6585 (2011.01); H01R 12/51 (2011.01); H01R 13/502 (2006.01); H01R 13/504 (2006.01); H01R 13/6582 (2011.01); H01R 13/6583 (2011.01); H01R 13/6586 (2011.01); H01R 13/6587 (2011.01); H01R 24/60 (2011.01)
CPC H01R 13/50 (2013.01) [H01R 13/40 (2013.01); H01R 13/405 (2013.01); H01R 13/6581 (2013.01); H01R 13/6585 (2013.01); H01R 12/51 (2013.01); H01R 13/502 (2013.01); H01R 13/504 (2013.01); H01R 13/6582 (2013.01); H01R 13/6583 (2013.01); H01R 13/6586 (2013.01); H01R 13/6587 (2013.01); H01R 24/60 (2013.01); H01R 2201/06 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A connector comprising:
a plurality of connection terminals including a plurality of upper connection terminals and a plurality of lower connection terminals;
a mold structure including a first portion and a second portion that contacts one end of the first portion and at least partially covers the plurality of connection terminals; and
a shield disposed on the second portion of the mold structure and including a conductive material,
wherein the plurality of upper connection terminals are disposed on a first surface of the first portion of the mold structure, and the plurality of lower connection terminals are disposed on a second surface of the first portion of the mold structure,
the second portion of the mold structure includes a flat part and a protruding part,
the shield extends on the flat part of the second portion of the mold structure,
the plurality of connection terminals are arranged according to a universal serial bus (USB) type-C pin standard,
the protruding part of the second portion of the mold structure protrudes from the flat part of the second portion of the mold structure by a first height of the protruding part of 0.03 mm to 0.13 mm, and faces one end of the shield,
a front end of the shield comprises a bevel with an inclined surface extending upward and away from the protruding part, and the bevel of the shield begins below the first height of the protruding part, and
wherein the shield is characterized by a second height of the shield above the flat part of the second portion, and the second height of the shield is greater than the first height of the protruding part, and thereby the bevel of the shield extends above the first height of the protruding part.