US 11,990,678 B2
Stack for fabricating an integrated circuit intended to perform an electromagnetic-lens function for a reconfigurable transmitarray antenna
Gabriel Pares, Grenoble (FR); Antonio Clemente, Grenoble (FR); and Bruno Reig, Grenoble (FR)
Assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Filed by COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Filed on May 31, 2022, as Appl. No. 17/804,738.
Claims priority of application No. 21 05741 (FR), filed on Jun. 1, 2021.
Prior Publication US 2022/0384963 A1, Dec. 1, 2022
Int. Cl. H01Q 21/00 (2006.01); H01L 23/528 (2006.01); H01Q 1/24 (2006.01); H01Q 15/02 (2006.01); H01Q 21/06 (2006.01); H05K 1/02 (2006.01)
CPC H01Q 21/0025 (2013.01) [H01L 23/5286 (2013.01); H01Q 1/24 (2013.01); H01Q 15/02 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/065 (2013.01); H05K 1/0243 (2013.01); H05K 2201/10098 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A stack for fabricating an integrated circuit to perform an electromagnetic-lens function for a reconfigurable transmitarray antenna, the stack comprising in succession:
a substrate, including a set of first active components configured to generate a phase shift, the substrate having first and second opposite surfaces, the first active components being integrated monolithically into the substrate;
a metal layer, forming a ground plane on the first surface of the substrate; and
a layer of a cured polymer, formed on the metal layer,
the stack further comprising:
a first interconnect structure formed on the second surface of the substrate, and electrically connected to the first active components, the first interconnect structure including first biasing lines arranged to bias the first active components;
a set of first planar antennas, formed on the first interconnect structure so as to be electrically connected to the first active components;
a set of second planar antennas, formed on the layer of the cured polymer, the sets of first and second planar antennas being aligned along a normal to the first and second surfaces of the substrate;
a plurality of vias, electrically insulated from the metal layer, and arranged to electrically connect pairs of planar antennas, each electrically connected pair of planar antennas including first and second planar antennas that are aligned along the normal to the first and second surfaces of the substrate.