US 11,990,558 B2
Transferable light emitting device array and production method thereof
Cheng Meng, Tianjin (CN); Chingyuan Tsai, Tianjin (CN); and Chun-I Wu, Tianjin (CN)
Assigned to Xiamen San'an Optoelectronics Co., Ltd., Hongtang Town (CN)
Filed by XIAMEN SAN'AN OPTOELECTRONICS CO., LTD., Xiamen (CN)
Filed on Jun. 22, 2020, as Appl. No. 16/908,114.
Claims priority of application No. 201910551455.5 (CN), filed on Jun. 24, 2019.
Prior Publication US 2020/0403114 A1, Dec. 24, 2020
Int. Cl. H01L 33/00 (2010.01); H01L 25/075 (2006.01)
CPC H01L 33/005 (2013.01) [H01L 25/0753 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method for producing a transferable array of light emitting devices, comprising:
forming, on a temporary substrate, a plurality of light emitting devices, each of which includes a light emitting structure and a release layer disposed over the light emitting structure;
forming at least one supporting member so that the at least one supporting member is directly connected to the release layer of at least one of the light emitting devices, the at least one supporting member being made from a curable resin;
connecting a supporting substrate only with the at least one supporting member so that the at least one supporting member extends from the release layer of the at least one of the light emitting devices to the supporting substrate for supporting the light emitting devices on the supporting substrate, and so that each of the light emitting devices is spaced apart from the supporting substrate by an air gap; and
removing the temporary substrate,
wherein the method further includes:
before formation of the light emitting devices, forming an intermediate layer on the temporary substrate such that the light emitting devices are formed on the intermediate layer opposite to the temporary substrate; and
after connection of the supporting substrate only with the at least one supporting member, removing the intermediate layer, and
wherein the intermediate layer has at least one recess indented from a top surface of the intermediate layer opposite to the temporary substrate, the at least one supporting member having a bottom part and embedded in the intermediate layer in a manner that the bottom part is disposed in the at least one recess.