CPC H01L 29/401 (2013.01) [H01L 21/32053 (2013.01); H01L 29/42392 (2013.01); H01L 29/4966 (2013.01); H01L 29/517 (2013.01); H01L 29/78696 (2013.01)] | 20 Claims |
1. A semiconductor structure, comprising:
a substrate;
a first semiconductor channel layer over the substrate;
a high-k gate dielectric layer over the first semiconductor channel layer;
a work function metal layer over the high-k gate dielectric layer; and
a bulk metal layer over the work function metal layer, wherein the work function metal layer includes a first portion and a second portion over the first portion, wherein the first portion and the second portion both include a first type of metal element and a nitride, the first portion is doped with silicon at a first dopant concentration, and the second portion is not doped with silicon or is doped with silicon at a second dopant concentration lower than the first dopant concentration.
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