US 11,990,495 B2
Image capturing unit and method for manufacturing the same
Takafumi Kishi, Kanagawa (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Oct. 20, 2020, as Appl. No. 17/075,536.
Application 17/075,536 is a continuation of application No. PCT/JP2019/016760, filed on Apr. 19, 2019.
Claims priority of application No. 2018-087519 (JP), filed on Apr. 27, 2018.
Prior Publication US 2021/0036044 A1, Feb. 4, 2021
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14636 (2013.01) [H01L 27/14618 (2013.01); H01L 27/14683 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An image capturing unit comprising a semiconductor chip constituting an image sensor and a substrate on which the semiconductor chip is mounted, the image capturing unit comprising:
a plurality of input wiring lines for controlling the semiconductor chip;
a plurality of first electrodes connecting to the input wiring lines; and
an input connector connecting to the input wiring lines,
wherein the substrate includes a first area and a second area on a first surface opposite to a second surface on which the semiconductor chip is mounted,
wherein the input connector and an electronic component are disposed in the first area, and at least one or more of the plurality of first electrodes are disposed in the second area, and
wherein the semiconductor chip can be driven via the plurality of first electrodes.