US 11,990,484 B2
Integrated circuit on flexible substrate manufacturing process
Richard Price, Sedgefield (GB); Brian Cobb, Sedgefield (GB); and Neil Davies, Sedgefield (GB)
Assigned to PRAGMATIC PRINTING LTD., Sedgefield Durham (GB)
Filed by PRAGMATIC PRINTING LTD., Sedgefield (GB)
Filed on Jul. 27, 2022, as Appl. No. 17/874,875.
Application 17/874,875 is a continuation of application No. 16/964,513, granted, now 11,462,575, previously published as PCT/GB2019/050243, filed on Jan. 30, 2019.
Claims priority of application No. 1801457 (GB), filed on Jan. 30, 2018.
Prior Publication US 2022/0359579 A1, Nov. 10, 2022
Int. Cl. H01L 21/78 (2006.01); H01L 27/12 (2006.01)
CPC H01L 27/1262 (2013.01) [H01L 21/78 (2013.01); H01L 27/1218 (2013.01); H01L 27/1266 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A process to manufacture a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising:
providing a carrier for a flexible substrate;
depositing a flexible substrate of uniform thickness on the carrier;
patterning the uniform thickness flexible substrate to define a plurality of IC substrate areas spaced apart from one another by a plurality of IC connecting areas;
(i) removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by the channels; and
(ii) forming an integrated circuit on at least one of the IC substrate units,
wherein step (i) precedes step (ii) and wherein the forming of the integrated circuit on the at least one of the IC substrate units includes separately depositing a plurality of layers of the integrated circuit on the at least one of the IC substrate units.