US 11,990,481 B2
Array substrate and manufacturing method thereof, display panel and backlight module
Zhanfeng Cao, Beijing (CN); Ke Wang, Beijing (CN); Zhiwei Liang, Beijing (CN); Jianguo Wang, Beijing (CN); Guocai Zhang, Beijing (CN); Xinhong Lu, Beijing (CN); and Qi Qi, Beijing (CN)
Assigned to BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/418,945
Filed by BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Sep. 18, 2020, PCT No. PCT/CN2020/116213
§ 371(c)(1), (2) Date Jun. 28, 2021,
PCT Pub. No. WO2022/056842, PCT Pub. Date Mar. 24, 2022.
Prior Publication US 2022/0310660 A1, Sep. 29, 2022
Int. Cl. H01L 27/12 (2006.01); G02F 1/13357 (2006.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01)
CPC H01L 27/124 (2013.01) [G02F 1/133603 (2013.01); H01L 25/0753 (2013.01); H01L 27/127 (2013.01); H01L 27/156 (2013.01); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An array substrate, comprising:
a base substrate;
a metal wiring layer provided on a side of the base substrate and comprising a first copper metal layer;
a planarization layer provided on a side of the metal wiring layer away from the base substrate;
a drive lead layer provided on a side of the planarization layer away from the base substrate, wherein the drive lead layer is electrically connected to the metal wiring layer, the drive lead layer comprises a second copper metal layer, and a thickness of the second copper metal layer is greater than a thickness of the first copper metal layer; and
a functional device layer provided on a side of the drive lead layer away from the base substrate, wherein the functional device layer is electrically connected to the metal wiring layer or the drive lead layer.