US 11,990,463 B2
Device for bonding chips
Markus Wimplinger, Ried in Kreis (AT)
Assigned to EV Group E. Thallner GmbH, St. Florian am Inn (AT)
Filed by EV Group E. Thallner GmbH, St. Florian am Inn (AT)
Filed on Jan. 8, 2021, as Appl. No. 17/144,655.
Application 17/144,655 is a division of application No. 16/483,077, granted, now 11,764,198, previously published as PCT/EP2017/054971, filed on Mar. 2, 2017.
Prior Publication US 2021/0134782 A1, May 6, 2021
Int. Cl. H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H05K 13/04 (2006.01)
CPC H01L 25/50 (2013.01) [H01L 24/74 (2013.01); H01L 24/75 (2013.01); H01L 24/80 (2013.01); H01L 25/0652 (2013.01); H05K 13/0404 (2013.01); H01L 2224/80003 (2013.01); H01L 2224/80011 (2013.01); H01L 2224/80013 (2013.01); H01L 2224/80894 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A device for bonding a plurality of chips onto a semiconductor substrate or onto further chips, the device comprising:
an ejector including a storage area for storing the plurality of chips; and
a bond head for positioning and aligning a chip of the plurality of chips, the bond head including
a first surface configured to couple to the chip of the plurality of chips that is to be bonded, and a second surface fixed to and disposed opposite the first surface,
a first spring element having a first spring constant, and
a second spring element having a second spring constant,
wherein the first spring constant is different from the second spring constant, and the first and second spring elements are coupled to the second surface.