US 11,990,459 B2
Method for producing electronic device comprising solar cell structure along with drive circuit
Junya Ishizaki, Takasaki (JP); Shogo Furuya, Takasaki (JP); and Tomohiro Akiyama, Annaka (JP)
Assigned to SHIN-ETSU HANDOTAI CO., LTD., Tokyo (JP)
Appl. No. 17/600,873
Filed by SHIN-ETSU HANDOTAI CO., LTD., Tokyo (JP)
PCT Filed Mar. 16, 2020, PCT No. PCT/JP2020/011380
§ 371(c)(1), (2) Date Oct. 1, 2021,
PCT Pub. No. WO2020/209010, PCT Pub. Date Oct. 15, 2020.
Claims priority of application No. 2019-074375 (JP), filed on Apr. 9, 2019.
Prior Publication US 2022/0173089 A1, Jun. 2, 2022
Int. Cl. H01L 31/02 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 31/18 (2006.01)
CPC H01L 25/167 (2013.01) [H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 31/02008 (2013.01); H01L 31/1876 (2013.01); H01L 31/1892 (2013.01); H01L 24/82 (2013.01); H01L 31/1844 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/245 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/92244 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for producing an electronic device having a drive circuit comprising a solar cell structure, the method comprising the steps of:
obtaining a bonded wafer by bonding a first wafer having a plurality of independent solar cell structures comprising a compound semiconductor, the plurality of independent solar cell structures being formed on a starting substrate by epitaxial growth, and a second wafer having a plurality of independent drive circuits formed, so that the plurality of independent solar cell structures and the plurality of independent drive circuits are respectively superimposed;
wiring the bonded wafer so that an electric power can be supplied from the plurality of independent solar cell structures to the plurality of independent drive circuits respectively; and
producing the electronic device having the drive circuit comprising the solar cell structure by dicing the bonded wafer.