US 11,990,454 B2
Package structure and method of forming the same
Hsi-Kuei Cheng, Zhubei (TW); Ching Fu Chang, Taipei (TW); Chih-Kang Han, Hsinchu (TW); and Hsin-Chieh Huang, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Dec. 14, 2020, as Appl. No. 17/120,918.
Application 16/050,881 is a division of application No. 15/366,996, filed on Dec. 1, 2016, granted, now 10,529,697, issued on Jan. 7, 2020.
Application 17/120,918 is a continuation of application No. 16/050,881, filed on Jul. 31, 2018, granted, now 10,867,973.
Claims priority of provisional application 62/396,055, filed on Sep. 16, 2016.
Prior Publication US 2021/0098434 A1, Apr. 1, 2021
Int. Cl. H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01); H01L 25/16 (2023.01)
CPC H01L 25/105 (2013.01) [H01L 21/486 (2013.01); H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01); H01L 25/065 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1076 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method comprising:
forming a plurality of first packages, each of the plurality of first packages comprising a first die surrounded by a molding compound;
partially cutting into a redistribution structure of the plurality of first packages;
after partially cutting into the redistribution structure of the plurality of first packages, bonding a plurality of second packages to the plurality of first packages;
dispensing an underfill in scribe line regions between adjacent ones of the plurality of second packages, the underfill extending up along sidewalls of the plurality of second packages, the underfill having curved top surfaces between the adjacent ones of the plurality of second packages; and
singulating the plurality of first and second packages, wherein singulating the plurality of first and second packages comprises:
cutting through the underfill at the curved top surfaces.