US 11,990,438 B2
Chiplets with connection posts
Carl Prevatte, Raleigh, NC (US); Christopher Bower, Raleigh, NC (US); Ronald S. Cok, Rochester, NY (US); and Matthew Meitl, Durham, NC (US)
Assigned to X Display Company Technology Limited, Dublin (IE)
Filed by X Display Company Technology Limited, Dublin (IE)
Filed on Nov. 10, 2022, as Appl. No. 17/984,748.
Application 16/543,015 is a division of application No. 14/822,864, filed on Aug. 10, 2015, granted, now 10,468,363, issued on Nov. 5, 2019.
Application 17/984,748 is a continuation of application No. 16/702,398, filed on Dec. 3, 2019, granted, now 11,552,034.
Application 16/702,398 is a continuation of application No. 16/543,015, filed on Aug. 16, 2019, granted, now 11,276,657, issued on Mar. 15, 2022.
Prior Publication US 2023/0146788 A1, May 11, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01)
CPC H01L 24/11 (2013.01) [H01L 24/08 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H05K 1/112 (2013.01); H05K 3/3436 (2013.01); H01L 21/4803 (2013.01); H01L 21/4846 (2013.01); H01L 2224/1144 (2013.01); H01L 2224/11466 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/1412 (2013.01); H01L 2224/1418 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1624 (2013.01); H01L 2224/17107 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/1304 (2013.01); H05K 3/305 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/10143 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method of making a printable component, comprising:
providing a forming substrate having two or more forms in a surface of the substrate;
disposing a patterned layer of conductive material at least in the forms to make connection posts;
disposing a first dielectric layer over the patterned layer of conductive material and the forming substrate;
disposing a chiplet having chiplet contact pads on the first dielectric layer;
forming conductors electrically connecting the connection posts to the chiplet contact pads; and
defining the printable component to form a release layer and anchors in the forming substrate connected by tethers to the printable component.