US 11,990,436 B2
Electronic circuit for a hybrid molecular bonding
Emilie Bourjot, Grenoble (FR); and Amandine Jouve, Grenoble (FR)
Assigned to Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Paris (FR)
Filed by Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Paris (FR)
Filed on Nov. 5, 2021, as Appl. No. 17/519,957.
Claims priority of application No. 2011734 (FR), filed on Nov. 16, 2020.
Prior Publication US 2022/0157752 A1, May 19, 2022
Int. Cl. H01L 21/66 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/06 (2013.01) [H01L 22/14 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/80 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/03921 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06132 (2013.01); H01L 2224/80031 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/83896 (2013.01); H01L 2224/9211 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electronic circuit comprising a surface intended to be attached to another electronic circuit by hybrid molecular bonding, the electronic circuit comprising:
an electrically-insulating layer exposed on said surface;
distributed in the electrically-insulating layer, first electrically-conductive bonding pads exposed on a first portion of said surface, the density of first bonding pads on the first portion of said surface being smaller than 30%; and
at least one electrically-conductive test pad, exposed on a second portion of said surface containing a square having a side length greater than 30 μm, the density of electrically-conductive material of the test pad exposed on the second portion of said surface being in the range from 40% to 80% and, everywhere in the second portion of said surface, at least one dimension of the electrically-conductive material exposed on the second portion of said surface being smaller than 10 μm.