US 11,990,435 B2
Fingerprint sensor and manufacturing method thereof
Sung Sun Park, Seoul (KR); Ji Young Chung, Seongnam-si (KR); and Christopher Berry, Chandler, AZ (US)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Jul. 18, 2022, as Appl. No. 17/867,287.
Application 17/867,287 is a continuation of application No. 16/601,928, filed on Oct. 15, 2019, granted, now 11,393,734.
Application 16/601,928 is a continuation of application No. 15/591,416, filed on May 10, 2017, granted, now 10,446,455, issued on Oct. 15, 2019.
Application 15/591,416 is a continuation of application No. 15/131,967, filed on Apr. 18, 2016, granted, now 10,297,515, issued on May 21, 2019.
Claims priority of application No. 10-2015-0065900 (KR), filed on May 12, 2015.
Prior Publication US 2023/0009679 A1, Jan. 12, 2023
Int. Cl. G06V 40/13 (2022.01); B81C 3/00 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01)
CPC H01L 24/05 (2013.01) [B81C 3/00 (2013.01); G06V 40/13 (2022.01); G06V 40/1329 (2022.01); H01L 23/053 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 23/3128 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/33 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05671 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/119 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/133 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27622 (2013.01); H01L 2224/2784 (2013.01); H01L 2224/29006 (2013.01); H01L 2224/29007 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29299 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/8146 (2013.01); H01L 2224/81464 (2013.01); H01L 2224/81466 (2013.01); H01L 2224/81471 (2013.01); H01L 2224/81484 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/8185 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/18161 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A fingerprint sensor device comprising:
a substrate comprising:
an upper substrate side, a bottom substrate side, and lateral substrate sides between the upper and bottom substrate sides;
a dielectric layer having an upper dielectric layer side, a lower dielectric layer side, and a lateral dielectric side extending between the upper dielectric layer side and the lower dielectric layer side; and
a conductive layer exposed from the upper dielectric layer side and the lower dielectric layer side;
a semiconductor die having a top die side facing the bottom substrate side, a bottom die side, and lateral die sides between the top and bottom die sides;
a plurality of first conductive interconnection structures electrically connecting the top die side to the bottom substrate side;
protective material adhered directly to the top die side and the bottom substrate side; and
a protective layer on the upper substrate side,
wherein:
the protective material does not contact the protective layer, and
the fingerprint sensor device is configured to sense a fingerprint of a finger positioned above the top die side.