US 11,990,429 B2
Dummy die placement without backside chipping
Chih-Wei Wu, Zhuangwei Township (TW); Ying-Ching Shih, Hsinchu (TW); Kung-Chen Yeh, Taichung (TW); Li-Chung Kuo, Taipei (TW); Pu Wang, Hsinchu (TW); and Szu-Wei Lu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Nov. 28, 2022, as Appl. No. 17/994,548.
Application 17/113,396 is a division of application No. 16/415,009, filed on May 17, 2019, granted, now 10,861,799, issued on Dec. 8, 2020.
Application 17/994,548 is a continuation of application No. 17/113,396, filed on Dec. 7, 2020, granted, now 11,515,267.
Prior Publication US 2023/0092361 A1, Mar. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H01L 21/3105 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/562 (2013.01) [H01L 21/31053 (2013.01); H01L 21/486 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a first package component;
a second package component over and bonding to the first package component;
a dummy die over and attached to the first package component; and
an encapsulant encapsulating the second package component therein, wherein the encapsulant comprises a first portion extending into the dummy die, and wherein a first top surface of the dummy die is coplanar with a second top surface of the first portion of the encapsulant.