CPC H01L 23/562 (2013.01) [H01L 21/563 (2013.01); H01L 21/78 (2013.01); H01L 23/3185 (2013.01); H01L 23/585 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/35121 (2013.01)] | 20 Claims |
1. A method comprising:
forming a plurality of unit regions in a wafer, each of the plurality of unit regions comprising a plurality of die regions;
forming a plurality of first seal rings in the wafer, each of the plurality of first seal rings surrounding a corresponding die region of the plurality of die regions, wherein the plurality of first seal rings do not overlap with each other in a plan view;
forming a plurality of second seal rings in the wafer, each of the plurality of second seal rings surrounding a corresponding unit region of the plurality of unit regions; and
forming a plurality of connectors over the wafer, each of the plurality of connectors having an elliptical shape in a plan view, a long axis in the plan view of each of the plurality of connectors being oriented toward a center point in the plan view of a corresponding unit region of the plurality of unit regions.
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