US 11,990,421 B2
Semiconductor device with compartment shield formed from metal bars and manufacturing method thereof
YongKook Shin, Gyoenggi-do (KR); KyoWang Koo, Incheon (KR); HeeYoun Kim, Incheon (KR); and SeongKuk Kim, Gyeonggi-do (KR)
Assigned to STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on Jan. 19, 2022, as Appl. No. 17/648,365.
Prior Publication US 2023/0230934 A1, Jul. 20, 2023
Int. Cl. H01L 21/52 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/4871 (2013.01); H01L 21/50 (2013.01); H01L 23/3121 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a first electrical component over the substrate;
disposing a second electrical component over the substrate;
forming a first metal bar by,
providing a carrier,
disposing a mask over the carrier,
forming an opening in the mask,
sputtering a metal layer over the mask, and
removing the mask to leave the first metal bar on the carrier; and
disposing the first metal bar over the substrate between the first electrical component and the second electrical component.