US 11,990,420 B2
Electromagnetic wave shielding sheet
Kazunori Matsudo, Tokyo (JP); Ryota Umezawa, Tokyo (JP); Kenji Ando, Tokyo (JP); and Tsutomu Hayasaka, Tokyo (JP)
Assigned to ARTIENCE CO., LTD., Tokyo (JP); and TOYOCHEM CO., LTD., Tokyo (JP)
Appl. No. 16/972,759
Filed by artience Co., Ltd., Tokyo (JP); and TOYOCHEM CO., LTD., Tokyo (JP)
PCT Filed Apr. 15, 2019, PCT No. PCT/JP2019/016185
§ 371(c)(1), (2) Date Dec. 7, 2020,
PCT Pub. No. WO2019/239710, PCT Pub. Date Dec. 19, 2019.
Claims priority of application No. 2018-111856 (JP), filed on Jun. 12, 2018.
Prior Publication US 2021/0242137 A1, Aug. 5, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H05K 9/00 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/31 (2013.01); H05K 9/0045 (2013.01); H05K 9/0081 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An electromagnetic wave shielding sheet before thermal pressing for forming an electromagnetic wave shielding layer, used for an electronic component-mounting substrate comprising a substrate, an electronic component mounted on one or both surfaces of the substrate, and an electromagnetic wave shielding layer that covers a step part formed by mounting the electronic component and at least a part of an exposed surface of the substrate and includes at least one of an electromagnetic wave reflection layer and an electromagnetic wave absorption layer, wherein:
the electromagnetic wave shielding sheet includes at least one of a conductive layer before thermal pressing of the electromagnetic wave reflection layer and a conductive layer before thermal pressing of the electromagnetic wave absorption layer;
the conductive layer before thermal pressing of the electromagnetic wave reflection layer comprises a binder resin and a conductive filler;
the conductive layer before thermal pressing of the electromagnetic wave absorption layer comprises a binder resin and an electromagnetic wave absorption filler; and
a Young's modulus of the conductive layer at 23° C. is 10 to 700 MPa.