US 11,990,411 B2
Device chip scale package including a protective layer
Tae Ki Kim, Incheon (KR); Jae Beom Shim, Incheon (KR); Seung Nam Son, Seoul (KR); and Won Chul Do, Seoul (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Apr. 13, 2022, as Appl. No. 17/720,211.
Application 17/720,211 is a continuation of application No. 16/387,924, filed on Apr. 18, 2019, abandoned.
Prior Publication US 2022/0238441 A1, Jul. 28, 2022
Int. Cl. H01L 23/528 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/5283 (2013.01) [H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method to manufacture a semiconductor device, comprising:
providing a redistribution layer (RDL) substrate on a first carrier, the RDL substrate having a top surface, a bottom surface, and a conductive structure;
placing an electronic device on the top surface of the RDL substrate;
providing a first protective material using a first molding operation, wherein the first protective material covers a side surface of the electronic device and the top surface of the RDL substrate;
attaching a second carrier to the first protective material;
removing the first carrier from the RDL substrate to expose the bottom surface of the RDL substrate and the conductive structure;
providing a conductive post on the bottom surface of the RDL substrate using a first plating operation;
providing a base structure comprising a second protective material using a second molding operation, wherein the second protective material covers a side surface of the conductive post and the bottom surface of the RDL substrate;
providing a base layer on a bottom side of the conductive post, wherein a bottommost side of the base layer is at a bottommost side of the second protective material; and
providing a conductive pillar below a bottom side of the base structure and coupled with the conductive post, wherein the conductive pillar is coupled with the conductive post through an opening in the base structure.