US 11,990,402 B2
Semiconductor apparatus and equipment
Yuichi Kazue, Tokyo (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Jan. 23, 2023, as Appl. No. 18/157,916.
Application 18/157,916 is a continuation of application No. 16/942,944, filed on Jul. 30, 2020, granted, now 11,699,653.
Claims priority of application No. 2019-146826 (JP), filed on Aug. 8, 2019.
Prior Publication US 2023/0163067 A1, May 25, 2023
Int. Cl. H01L 23/522 (2006.01); H01L 27/146 (2006.01)
CPC H01L 23/5226 (2013.01) [H01L 27/14627 (2013.01); H01L 27/14636 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor apparatus, comprising:
a first substrate, which includes a photoelectric conversion element;
an insulating member;
a second substrate overlapped with the first substrate via the insulating member; and
an electrode portion disposed between the first substrate and the second substrate,
wherein:
a through via is disposed to pass through the second substrate, and
an opening for exposing the electrode portion to outside is arranged at a position overlapping the electrode portion, and is arranged in the first substrate.