US 11,990,396 B2
Substrate and method for manufacturing the same
Kazuyuki Mitsukura, Tokyo (JP); Masaya Toba, Tokyo (JP); Yoshinori Ejiri, Tokyo (JP); and Kazuhiko Kurafuchi, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Filed by SHOWA DENKO MATERIALS CO., LTD., Tokyo (JP)
Filed on Dec. 19, 2022, as Appl. No. 18/068,032.
Application 18/068,032 is a continuation of application No. 16/983,012, filed on Aug. 3, 2020, granted, now 11,562,951.
Application 16/983,012 is a continuation of application No. 16/087,269, granted, now 10,756,008, issued on Aug. 25, 2020, previously published as PCT/JP2017/006840, filed on Feb. 23, 2017.
Claims priority of application No. 2016-061899 (JP), filed on Mar. 25, 2016.
Prior Publication US 2023/0118368 A1, Apr. 20, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/12 (2006.01); H01L 23/14 (2006.01); H01L 23/32 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H05K 1/09 (2006.01)
CPC H01L 23/49822 (2013.01) [H01L 21/4857 (2013.01); H01L 23/12 (2013.01); H01L 23/145 (2013.01); H01L 23/32 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 25/0652 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H05K 1/09 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate for a semiconductor package, comprising:
an organic insulating resin layer including a groove;
a first wire located in the groove;
a barrier conductive material covering the first wire; and
a second wire located above the first wire,
wherein the barrier conductive material includes:
a first barrier conductive film interposed between the first wire and the groove; and
a second barrier conductive film located on the first wire,
wherein the second wire is in contact with both of the first barrier conductive film and the second barrier conductive film; and
wherein an upper surface of the first wire is substantially aligned with an upper surface of the organic insulating resin layer.