US 11,990,395 B2
Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement
Xiaoying Tang, Shanghai (CN); Zhicheng Ding, Shanghai (CN); Bin Liu, Shanghai (CN); Yong She, Shanghai (CN); and Zhijun Xu, Shanghai (CN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Appl. No. 17/425,227
Filed by Intel Corporation, Santa Clara, CA (US)
PCT Filed Feb. 22, 2019, PCT No. PCT/CN2019/075875
§ 371(c)(1), (2) Date Jul. 22, 2021,
PCT Pub. No. WO2020/168552, PCT Pub. Date Aug. 27, 2020.
Prior Publication US 2022/0122907 A1, Apr. 21, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49816 (2013.01) [H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/14179 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/27849 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/15311 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a package substrate having a top surface, wherein the top surface includes a corner portion;
a plurality of solder balls on the top surface of the package substrate; and
a pattern on the corner portion of the package substrate, wherein the pattern has a width that is substantially equal to a width of the plurality of solder balls, wherein the pattern includes a continuous line, wherein the continuous line includes one or more solder materials, and wherein a solder composition of the continuous line varies along the continuous line.