| CPC H01L 23/49568 (2013.01) [H01L 24/37 (2013.01); H01L 24/38 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 24/84 (2013.01); H01L 2224/37 (2013.01); H01L 2224/40 (2013.01); H01L 2924/181 (2013.01)] | 1 Claim |
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1. A semiconductor device comprising:
a semiconductor element having a first surface and a second surface opposite from each other, and having a first electrode exposed on the first surface and a second electrode disposed on the second surface;
a lead frame including a mounting portion and a non-mounting portion divided from the mounting portion, the mounting portion having a mounting surface to which the semiconductor element is mounted and the first electrode is electrically connected, and an opposite surface opposite from the mounting surface;
a bridge member having conductivity and electrically connecting the second electrode and the non-mounting portion; and
a sealing resin having electric insulation, having a thermal conductivity of 2.2 W or more, and covering the semiconductor element, the lead frame, and the bridge member in a state where the opposite surface of the mounting portion is exposed from the sealing resin, wherein
the sealing resin includes, as constituent materials, an electrically insulating resin and a filler having a higher thermal conductivity than the electrically insulating resin, and has a surface resin portion disposed on the bridge member, and
the surface resin portion has a thickness of 0.2 mm or more and 0.6 mm or less.
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