US 11,990,391 B2
Semiconductor device
Masayoshi Nishihata, Kariya (JP); and Shota Yoshikawa, Kariya (JP)
Assigned to DENSO CORPORATION, Kariya (JP)
Filed by DENSO CORPORATION, Kariya (JP)
Filed on Sep. 14, 2021, as Appl. No. 17/475,102.
Application 17/475,102 is a continuation of application No. PCT/JP2020/004299, filed on Feb. 5, 2020.
Claims priority of application No. 2019-051427 (JP), filed on Mar. 19, 2019.
Prior Publication US 2022/0005750 A1, Jan. 6, 2022
Int. Cl. H01L 23/492 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 25/07 (2006.01)
CPC H01L 23/492 (2013.01) [H01L 23/3107 (2013.01); H01L 23/367 (2013.01); H01L 25/072 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first semiconductor element;
a second semiconductor element connected in series with the first semiconductor element;
a first terminal;
a second terminal, the second terminal and the first terminal allowing a current to flow between the second terminal and the first terminal;
a first metal plate arranged to face both the first semiconductor element and the second semiconductor element and electrically connected to the second terminal;
a second metal plate arranged to face the first metal plate and to interpose the first semiconductor element between the first metal plate and the second metal plate, and electrically connected to the first terminal;
a third metal plate arranged to face the first metal plate and to interpose the second semiconductor element between the first metal plate and the third metal plate; and
a sealing resin body covering the first semiconductor element, the second semiconductor element, the first metal plate, the second meal plate and the third metal plate, wherein
the second semiconductor element has a first electrode on a surface adjacent to the third metal plate and electrically connected to the third metal plate, and a second electrode on a surface adjacent to the first metal plate and electrically connected to the first metal plate,
the first semiconductor element has a first electrode on a surface adjacent to the second metal plate and electrically connected to the second metal plate, and a second electrode on a surface adjacent to the first metal plate and electrically connected to the third metal plate,
the first semiconductor element is thermally connected to the first metal plate while being electrically insulated from the first metal plate by an insulator, the first metal plate has an exposed surface exposed from the sealing resin body on a side opposite to the first semiconductor element and the second semiconductor element,
the second metal plate has an exposed surface exposed from the sealing resin body on a side opposite to the first semiconductor element, and
the third metal plate has an exposed surface exposed from the sealing resin body on a side opposite to the second semiconductor element.