US 11,990,389 B2
Semiconductor package including embedded cooling structure
Keeyoung Son, Daejeon (KR); Joung-Ho Kim, Daejeon (KR); Subin Kim, Daejeon (KR); Shinyoung Park, Daejeon (KR); Seungtaek Jeong, Daejeon (KR); Gapyeol Park, Daejeon (KR); Boogyo Sim, Daejeon (KR); Hyunwook Park, Daejeon (KR); Taein Shin, Daejeon (KR); Seongguk Kim, Daejeon (KR); Kyungjune Son, Daejeon (KR); and Minsu Kim, Daejeon (KR)
Assigned to Korea Advanced Institute Of Science And Technology, Daejeon (KR)
Filed by KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, Daejeon (KR)
Filed on Dec. 14, 2021, as Appl. No. 17/550,347.
Claims priority of application No. 10-2021-0097545 (KR), filed on Jul. 26, 2021.
Prior Publication US 2023/0028887 A1, Jan. 26, 2023
Int. Cl. H01L 23/473 (2006.01); H01L 23/373 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)
CPC H01L 23/473 (2013.01) [H01L 23/3736 (2013.01); H01L 23/481 (2013.01); H01L 23/49822 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
an interposer;
an electronic device arranged on the interposer having a first side surface and a second side surface opposite to the first side surface, the electronic device including a plurality of memory dies stacked in a vertical direction;
at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, the first through pipe moving a cooling liquid therein;
a second through pipe passing through the interposer and in fluid communication with the first through pipe to move the cooling liquid therein;
an inlet portion in fluid communication with the second through pipe to introduce the cooling liquid;
an outlet portion disposed on the electronic device and in fluid communication with the first through pipe to discharge the cooling liquid to the outside; and
a plurality of thermal transmission lines extending in a horizontal direction in each of the memory dies, the thermal transmission lines extending parallel with each other from the first through pipe toward the second side surface.