CPC H01L 23/473 (2013.01) [H01L 23/3736 (2013.01); H01L 23/481 (2013.01); H01L 23/49822 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01)] | 8 Claims |
1. A semiconductor package, comprising:
an interposer;
an electronic device arranged on the interposer having a first side surface and a second side surface opposite to the first side surface, the electronic device including a plurality of memory dies stacked in a vertical direction;
at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, the first through pipe moving a cooling liquid therein;
a second through pipe passing through the interposer and in fluid communication with the first through pipe to move the cooling liquid therein;
an inlet portion in fluid communication with the second through pipe to introduce the cooling liquid;
an outlet portion disposed on the electronic device and in fluid communication with the first through pipe to discharge the cooling liquid to the outside; and
a plurality of thermal transmission lines extending in a horizontal direction in each of the memory dies, the thermal transmission lines extending parallel with each other from the first through pipe toward the second side surface.
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