US 11,990,385 B2
Electronic device
Li-Chieh Hung, Kaohsiung (TW); and Hung-Chun Kuo, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Feb. 25, 2022, as Appl. No. 17/681,694.
Prior Publication US 2023/0275000 A1, Aug. 31, 2023
Int. Cl. H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01)
CPC H01L 23/3677 (2013.01) [H01L 23/481 (2013.01); H01L 23/50 (2013.01); H01L 23/5385 (2013.01); H01L 23/5387 (2013.01); H01L 25/18 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/17181 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
an electronic component having a passive surface;
a heat dissipation structure comprising a plurality of conductive elements physically separated from each other, wherein the electronic component and the respective conductive elements are configured to provide a plurality of power paths passing through the passive surface;
a plurality of first connections disposed between the heat dissipation structure and the electronic component and configured to electrically connect the conductive elements to the electronic component; and
a thermal dissipation insulating layer covering the first connections and exposing a portion of the first connections.