US 11,990,383 B2
Package structure having at least one die with a plurality of taper-shaped die connectors
Hung-Jui Kuo, Hsinchu (TW); Hui-Jung Tsai, Hsinchu (TW); Tai-Min Chang, Taipei (TW); and Chia-Wei Wang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Nov. 2, 2022, as Appl. No. 17/979,713.
Application 17/979,713 is a continuation of application No. 16/886,755, filed on May 28, 2020, granted, now 11,508,633.
Prior Publication US 2023/0054148 A1, Feb. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3114 (2013.01) [H01L 21/561 (2013.01); H01L 23/5384 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05099 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
at least one die comprising a plurality of die connectors;
a plurality of taper-shaped through vias, wherein each of the plurality of taper-shaped through vias comprises a conductive layer and a taper-shaped conductive pillar on the conductive layer;
an encapsulant laterally encapsulating the at least one die and the plurality of taper-shaped through vias; and
a redistribution structure, disposed over the encapsulant and electrically connected with the at least one die and the plurality of taper-shaped through vias, wherein the redistribution structure is in direct contact with a terminal surface of each of the plurality of die connectors, a width of the taper-shaped conductive pillar gradually decreases from the conductive layer toward the redistribution structure, each of the plurality of die connectors is a taper-shaped die connector, and an area of a cross section of each of the plurality of die connectors is greater than an area of the terminal surface of each of the plurality of die connectors.