US 11,990,381 B2
Integrated circuit packages having support rings
Shu-Rong Chun, Zhubei (TW); Kuo Lung Pan, Hsinchu (TW); Tin-Hao Kuo, Hsinchu (TW); Hao-Yi Tsai, Hsinchu (TW); Pei-Hsuan Lee, Tainan (TW); Chien Ling Hwang, Hsinchu (TW); Yu-Chia Lai, Zhunan Township (TW); Po-Yuan Teng, Hsinchu (TW); and Chen-Hua Yu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Nov. 14, 2022, as Appl. No. 17/986,498.
Application 17/315,735 is a division of application No. 16/442,907, filed on Jun. 17, 2019, granted, now 11,004,758, issued on May 11, 2021.
Application 17/986,498 is a continuation of application No. 17/315,735, filed on May 10, 2021, granted, now 11,502,013.
Prior Publication US 2023/0103560 A1, Apr. 6, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/32 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/31 (2013.01) [H01L 21/56 (2013.01); H01L 23/32 (2013.01); H01L 23/5386 (2013.01); H01L 23/562 (2013.01); H01L 25/0655 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a package component comprising:
integrated circuit dies;
an encapsulant around the integrated circuit dies;
a redistribution structure over the encapsulant, the redistribution structure comprising redistribution lines that are electrically coupled to the integrated circuit dies; and
a support ring over the redistribution structure, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.