US 11,990,353 B2
Semiconductor device with buffer layer
Hwee Seng Jimmy Chew, Singapore (SG); and Senthil Kumar Munirathinam, Singapore (SG)
Assigned to PEP INNOVATION PTE. LTD., Singapore (SG)
Filed by PEP INNOVATION PTE. LTD., Singapore (SG)
Filed on Jul. 15, 2021, as Appl. No. 17/376,187.
Application 17/346,310 is a division of application No. 15/826,268, filed on Nov. 29, 2017, granted, now 11,049,734, issued on Jun. 29, 2021.
Application 17/376,187 is a continuation in part of application No. 17/346,310, filed on Jun. 14, 2021.
Claims priority of provisional application 63/114,536, filed on Nov. 17, 2020.
Claims priority of application No. 10202006768U (SG), filed on Jul. 15, 2020.
Prior Publication US 2021/0343549 A1, Nov. 4, 2021
Int. Cl. H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01)
CPC H01L 21/568 (2013.01) [H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/367 (2013.01); H01L 23/49838 (2013.01); H01L 23/528 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 25/0657 (2013.01); H01L 23/5389 (2013.01); H01L 2223/5448 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/97 (2013.01); H01L 2924/19105 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a die with active and inactive surfaces, wherein the active surface includes die pads on a back-end-of-line (BEOL) dielectric;
a buffer layer disposed on the active surface of the die, wherein the buffer layer includes a vibration damping composition to prevent cracking of the BEOL dielectric from a wafer singulation process;
via openings in the buffer layer to expose the die pads; and
via contacts disposed on the via openings to provide electrical connection to the die pads.