US 11,990,319 B2
Methods and apparatus for processing a substrate
Yida Lin, Santa Clara, CA (US); Rui Li, San Jose, CA (US); Martin Lee Riker, Round Rock, TX (US); Haitao Wang, Fremont, CA (US); Noufal Kappachali, San Jose, CA (US); and Xiangjin Xie, Fremont, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jan. 5, 2022, as Appl. No. 17/568,836.
Prior Publication US 2023/0230806 A1, Jul. 20, 2023
Int. Cl. H01J 37/32 (2006.01); B23K 15/00 (2006.01)
CPC H01J 37/32183 (2013.01) [B23K 15/0006 (2013.01); H01J 2237/327 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An RF power delivery compensation circuit, comprising:
a first input configured to receive an RF forward power from an RF power source connected to a processing chamber; and
a second input configured to receive an RF delivered power from a matching network connected between the RF power source and the processing chamber,
wherein the RF power delivery compensation circuit calculates an RF forward power compensation factor based on the RF forward power and the RF delivered power for adjusting the RF forward power delivered to the processing chamber during operation.