US 11,988,960 B2
Organometallic solution based high resolution patterning compositions
Stephen T. Meyers, Corvallis, OR (US); Douglas A. Keszler, Corvallis, OR (US); Kai Jiang, Corvallis, OR (US); Jeremy T. Anderson, Corvallis, OR (US); and Andrew Grenville, Corvallis, OR (US)
Assigned to Inpria Corporation, Corvallis, OR (US)
Filed by Inpria Corporation, Corvallis, OR (US)
Filed on Sep. 6, 2022, as Appl. No. 17/903,369.
Application 17/903,369 is a continuation of application No. 17/830,535, filed on Jun. 2, 2022.
Application 17/830,535 is a continuation of application No. 16/536,768, filed on Aug. 9, 2019.
Application 16/536,768 is a continuation of application No. 16/007,242, filed on Jun. 13, 2018, granted, now 10,416,554, issued on Sep. 17, 2019.
Application 16/007,242 is a continuation of application No. 14/983,220, filed on Dec. 29, 2015, granted, now 10,025,179, issued on Jul. 18, 2018.
Application 14/983,220 is a continuation of application No. 13/973,098, filed on Aug. 22, 2013, granted, now 9,310,684, issued on Apr. 12, 2016.
Prior Publication US 2023/0004081 A1, Jan. 5, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/004 (2006.01); G03F 7/09 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); G03F 7/32 (2006.01)
CPC G03F 7/0042 (2013.01) [G03F 7/0043 (2013.01); G03F 7/09 (2013.01); G03F 7/20 (2013.01); G03F 7/2002 (2013.01); G03F 7/2037 (2013.01); G03F 7/30 (2013.01); G03F 7/32 (2013.01); G03F 7/322 (2013.01); G03F 7/325 (2013.01)] 35 Claims
 
1. A method for forming a patterned film supported by a substrate, the method comprising:
irradiating a layer of material supported by the substrate by exposing the layer of material to patterned radiation to form an irradiated structure with a region of irradiated material and a region with un-irradiated material, wherein the layer of material has a thickness in a range from about 1 nm to about 200 nm, wherein the un-irradiated material comprises a metal oxo-hydroxo network with metal cations having organic ligands with metal carbon bonds and/or with metal carboxylate bonds, and wherein the irradiated material is at least partially condensed to increase metal oxide character; and
developing the irradiated structure to selectively remove irradiated material or un-irradiated material to form the patterned film supported by the substrate.