	US 11,988,958 B2
	Organometallic solution based high resolution patterning compositions
Stephen T. Meyers, Corvallis, OR (US); Douglas A. Keszler, Corvallis, OR (US); Kai Jiang, Corvallis, OR (US); Jeremy T. Anderson, Corvallis, OR (US); and Andrew Grenville, Corvallis, OR (US)
Assigned to Inpria Corporation, Corvallis, OR (US)
Filed by Inpria Corporation, Corvallis, OR (US)
Filed on Aug. 9, 2019, as Appl. No. 16/536,768.
Application 16/536,768 is a continuation of application No. 16/007,242, filed on Jun. 13, 2018, granted, now 10,416,554.
Application 16/007,242 is a continuation of application No. 14/983,220, filed on Dec. 29, 2015, granted, now 10,025,179, issued on Jul. 17, 2018.
Application 14/983,220 is a continuation of application No. 13/973,098, filed on Aug. 22, 2013, granted, now 9,310,684, issued on Apr. 12, 2016.
Prior Publication US 2019/0369489 A1, Dec. 5, 2019
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/004 (2006.01); G03F 7/09 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); G03F 7/32 (2006.01)

CPC G03F 7/0042 (2013.01) [G03F 7/0043 (2013.01); G03F 7/09 (2013.01); G03F 7/20 (2013.01); G03F 7/2002 (2013.01); G03F 7/2037 (2013.01); G03F 7/30 (2013.01); G03F 7/32 (2013.01); G03F 7/322 (2013.01); G03F 7/325 (2013.01)]

21 Claims

1. A method for patterning a substrate with radiation, the method comprising:

irradiating a coated substrate along a selected pattern, wherein the coated substrate comprises a coating that comprises EUV radiation sensitive metal-carbon bonds, wherein exposure of the coating material to EUV radiation at a dose from about 3 mJ/cm²to 150 mJ/cm²alters the chemical properties of the coating material to create an exposed coating material with differential dissolution rates between exposed and un-exposed regions of the coating material and wherein the irradiated regions are at least partially condensed to increase metal oxide character, wherein the metal of the metal—carbon bonds consists of Sn, Sb, In or a combination thereof.