US 11,988,882 B2
Device for transferring heat between a first module and a second module
Fredrik Ohlsson, Kista (SE)
Assigned to Huawei Technologies Co., Ltd., Shenzhen (CN)
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
Filed on Jan. 13, 2022, as Appl. No. 17/575,337.
Application 17/575,337 is a continuation of application No. PCT/EP2020/054708, filed on Feb. 24, 2020.
Prior Publication US 2022/0137311 A1, May 5, 2022
Int. Cl. H05K 7/20 (2006.01); G02B 6/42 (2006.01)
CPC G02B 6/4269 (2013.01) [H05K 7/20418 (2013.01); H05K 7/2049 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device for transferring heat between a first module and a second module, the device comprising:
a holder for holding the second module;
a first unit configured to be thermally coupled to the first module;
a second unit movable in a first direction in relation to the first unit and the holder, the first unit and the second unit being thermally coupled to each other; and
a biasing apparatus for urging the second unit away from the first unit, and urging the second unit against the second module held in the holder; and
wherein one of the first unit and the second unit comprises a plurality of protrusions and the other one of the first unit and the second unit comprises a plurality of cavities, each cavity of the plurality of cavities being complementary to one of the plurality of protrusions;
wherein each protrusion of the plurality of protrusions engages one of the plurality of cavities; and
wherein each protrusion of the plurality of protrusions has a contact surface, and each cavity of the plurality of cavities has a contact surface, the contact surface of each protrusion of the plurality of protrusions facing the contact surface of one of the plurality of cavities.