US 11,988,743 B2
Molded proximity sensor
Jing-En Luan, Singapore (SG); and Jerome Teysseyre, Ang Mo Kio (SG)
Assigned to STMICROELECTRONICS PTE LTD, Singapore (SG)
Filed by STMICROELECTRONICS PTE LTD, Singapore (SG)
Filed on Nov. 14, 2022, as Appl. No. 18/055,138.
Application 18/055,138 is a continuation of application No. 16/562,189, filed on Sep. 5, 2019, granted, now 11,513,220.
Application 16/562,189 is a continuation of application No. 14/674,650, filed on Mar. 31, 2015, granted, now 10,429,509, issued on Oct. 1, 2019.
Claims priority of application No. 201410831009.7 (CN), filed on Dec. 24, 2014; and application No. 201410833225.5 (CN), filed on Dec. 25, 2014.
Prior Publication US 2023/0071048 A1, Mar. 9, 2023
Int. Cl. G01S 17/04 (2020.01); G01S 7/481 (2006.01); H01L 25/16 (2023.01); H01L 31/173 (2006.01)
CPC G01S 17/04 (2020.01) [G01S 7/4813 (2013.01); H01L 25/167 (2013.01); H01L 31/173 (2013.01); H01L 2224/16 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a first board substrate including a first surface and a second surface opposite to the first surface;
a first die coupled to the first surface of the first board substrate, the first die including a third surface facing away from the first board substrate, a sensor area along the fourth third surface, and a plurality of sidewalls that are transverse to the third surface;
a first lens on the third surface of the first die and overlapping the sensor area of the first die, the first lens including a plurality of sidewalls transverse to the third surface, and the plurality of sidewalls of the first lens are spaced inward from the plurality of sidewalls of the first die;
a die assembly coupled to the first board substrate and on the first board substrate, the die assembly including:
a second die including a fourth surface facing away from the first board substrate and a light emitting area along the fourth surface;
a plurality of sidewalls that are transverse to the first surface and extend from the fourth surface towards the first board substrate; and
a second lens overlaps the second die and overlaps the light emitting area of the second die, the second lens includes a plurality of sidewalls transverse to the first surface;
a molding compound coupled to the first surface of the first board substrate, coupled to the plurality of sidewalls of the first die, coupled to the third surface of the first die, coupled to the plurality of sidewalls of the first lens, coupled to the plurality of sidewalls of the die assembly, and coupled to the plurality of sidewalls of the second lens.